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Cold Plate Applications

 

 

Cold Plate & Direct-to-Chip Liquid Cooling Solutions

High‑performance liquid cold plates made by additive manufacturing to deliver efficient direct‑to‑chip cooling for high‑power CPUs, GPUs and power electronics, reducing thermal resistance and pumping power while improving reliability in dense, mission‑critical systems.

Chip Cooling (CPU, GPU & Accelerators)

Additively manufactured microchannel and lattice cold plates manage extreme chip heat flux in AI and HPC servers, enabling higher rack densities and stable junction temperatures in liquid‑cooled data centers.

 Power Electronics

One‑piece, corrosion‑resistant cold plates with integrated manifolds cool high‑power converters, inverters and drive electronics, lowering thermal resistance and pressure drop while improving efficiency and uptime.

 Laser and Photonics Cooling

Precision liquid cold plates with ultra‑stable, low‑vibration flow paths remove intense, localized heat from high‑energy lasers, radar T/R modules and photonics hardware, protecting alignment, beam quality and operational availability.

 EV Battery Cooling

Lightweight, conformal cold plates with integrated manifolds minimise cell‑to‑cell temperature variation, supporting faster charging, longer cycle life and reduced system pumping power in space‑ and weight‑constrained battery packs.

 Request cold plates

Cold plate heat sinks provide high-efficiency liquid cooling for power electronics, battery thermal management, avionics heat dissipation, and mission-critical computing. They ensure effective heat dissipation, enhancing component longevity and system performance. Common types include flat tube cold plates, serpentine channel cold plates, friction stir welded cold plates, and microchannel cold plates. Typical fluid pairings include water-to-glycol for cooling, dielectric fluids-to-water for electrical insulation, and refrigerant-to-liquid for high-efficiency thermal regulation.

Traditional cold plates rely on machined channels or bonded fins, which limit heat transfer efficiency and design flexibility. Conflux Technology leverages additive manufacturing to create advanced cold plate designs with optimized internal fluid pathways, reducing hot spots, improving flow distribution, and enhancing overall thermal conductivity. Our solutions provide greater cooling capacity in smaller footprints, improved reliability, and customized geometries for highly integrated thermal management systems.

Cold plates by Conflux

Macro Heatsink Heat Exchange

macro Heatsink Heat Exchange

Features

 

 

Experience unparalleled performance with Conflux heat exchangers. Our innovative approach redefine what’s possible in thermal management, offering four key advantages to elevate the performance of the most demanding systems.

 

Superior Heat Dissipation

Direct cooling of electronic components for enhanced thermal management.

 Lightweight Construction

Reduced mass for easy integration into weight-sensitive applications like aerospace.

 Low Thermal Resistance

Precision channels reduce thermal resistance for faster heat removal.

 Scalable Design

Adaptable to various sizes and power densities for different cooling needs.

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