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Data Center Thermal Applications

For data centers and edge infrastructure, additively manufactured liquid cold plates provide efficient direct-to-chip cooling for high-power CPUs, GPUs and accelerators. These high-performance thermal solutions support higher rack densities, lower pumping power, reduced water consumption, and improved system reliability in AI-critical environments.

Cold Plates

Direct-to-chip liquid cold plates remove heat at the source, delivering high thermal performance with a low pressure drop. Fully configurable geometry and port placement mean every cold plate can be tuned to the exact CPU or GPU application.

 Two-Phase Cold Plates

Two-phase cold plates use phase-change cooling to handle extreme heat flux from next-gen, high-power accelerators. This approach maintains tighter, more uniform temperature control at densities single-phase cooling can't reach, while supporting non-water cooling loops.

 Immersion Cooling

Immersion cooling submerges servers directly in dielectric fluid, removing heat across the entire system rather than a single component. It's built for the highest-density deployments, where air and traditional liquid cooling reach their limits.

 CDU (Coolant Distribution Unit)

CDUs manage the flow, pressure, and temperature of coolant between the facility loop and the rack, isolating server-side cooling from the building's water supply. They're the backbone that makes direct-to-chip and hybrid cooling deployments reliable at scale.

 Edge

Edge deployments demand compact, rugged thermal solutions that reliably outperform in a traditional data center. Conflux's lightweight, corrosion-resistant designs bring the same high-performance cooling to edge and micro data center sites.

Features

Conflux’s cold plates combine high heat-transfer efficiency, low pressure drop, and inherently leak-resistant construction, engineered to keep data center CPUs, GPUs, and accelerators running reliably under extreme, escalating thermal loads while reducing water consumption and cooling energy.

 

 

High Heat Transfer Rates

Advanced microchannel geometries deliver up to 15% lower thermal resistance than a leading copper cold plate benchmark, even at extreme power densities supporting 45°C coolant inlet temperatures. This supports higher rack densities and tighter thermal control for the most demanding CPUs and GPUs.

 

 Low Pressure Drop

CFD-optimized internal flow reduces pump energy demands, cutting cold plate pump power and enabling lower cooling loop operating cost. Lower pressure drop means immediate PUE improvements at scale.

 

 Monolithic, Leak-Resistant Construction

Built as a single piece with no brazed joints, weld seams, or dissimilar metals, Conflux cold plates eliminate the leak paths common in conventional designs.

 

 Lightweight, Configurable Design

Laser powder bed fusion (LPBF) places material only where needed, cutting weight to roughly a third of comparable cold plates without sacrificing thermal performance. Fully configurable in copper or aluminum, single- or two-phase, to match any chip size, coolant type, and rack architecture.

 

Gallery

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Meet with us

Discover our direct to chip liquid cooling technology

As data centers push toward higher rack densities and tighter thermal margins, Conflux is redefining what's possible in liquid cooling. Talk to us about how our cold plates, immersion cooling, and CDU solutions can reduce cooling energy, cut water use, and support your next deployment.

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