Direct to Chip Cold Plates

Precision-engineered direct-to-chip cold plates for high-performance CPUs and GPUs.

Direct-to-Chip Cold Plates

An innovative direct‑to‑chip liquid cooling solution for high‑performance CPUs and GPUs that demand ultra‑low thermal resistance and efficient heat removal with minimal pressure drop.

Our direct-to-chip copper cold plates deliver under 0.0076°C/W thermal resistance with up to 10x lower pressure drop compared to a leading copper cold plate benchmark, enabling tighter junction‑to‑coolant deltas and higher safe power per device in a compact, configurable footprint.

Engineered by experienced thermal design specialists and backed by correlated analysis, validated test data, and application‑specific development programs, they give integrators a proven path to deploy high‑density liquid cooling with upside for increased revenue and/or OPEX savings.

Up to 15% lower thermal resistance and 10x lower pressure drop compared to a leading copper cold plate benchmark.

Configurable Cold Plates Across GPU and CPU Liquid Cooling

No Size or Application Limits. Configure Your Direct-to-Chip Cold Plate.

Conflux direct‑to‑chip cold plates can be fully tailored to your application. Choose from high‑performance copper or lightweight aluminum, configure length, width, and height to fit any chip size and server rack architecture, and specify port type, position, and orientation.

With 3D printing, we can also shape internal flow paths and manifolds to direct coolant precisely where it is needed, increasing flow over known hotspots and redistributing it across non‑uniform chip layouts.

This design flexibility lets us tune local thermal performance, reducing junction temperatures at critical regions, without sacrificing overall pressure drop or compatibility with your existing loop architecture.

Our additive manufacturing process shortens the path from concept to production, enabling rapid iteration of internal channel geometry and faster time‑to‑deployment for new CPU and GPU platforms.

Get in contact with our team to discuss your project and how application‑specific flow routing can improve hotspot cooling in your next design.

Access Direct-to-Chip Cold Plate Performance Data

Download indicative thermal resistance and pressure drop performance curves, benchmark comparisons, and validation context for the Conflux Direct-to-Chip Cold Plate range.

The Conflux Core™ Inside Every Direct-To-Chip Cold Plate

At the center of every Conflux Direct-to-Chip Cold Plate is the Conflux Core™ – an additively manufactured internal geometry with optimized flow paths engineered to deliver strong heat transfer in a compact, low-pressure-drop package for the most demanding CPU and GPU applications.

Thermal effectiveness for direct-to-chip cooling

The Conflux Core™ geometry is engineered for high heat-transfer efficiency at extreme heat flux, using advanced microchannel structures that maximize internal surface area without increasing footprint.

Low pressure drop to minimize pump power

CFD-optimized internal flow paths reduce pumping energy demands, lowering cooling loop operating costs and improving system-level PUE.

Monolithic, leak-resistant construction for high-density racks

Single-piece additive manufacturing eliminates brazed joints and leak paths, maintaining structural integrity within tightly constrained, high-density rack architectures.

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Conflux is proud to work with industry leaders including:

Ready to spec a Conflux Direct-to-Chip Cold Plate?

Whether you're selecting a copper or aluminum cold plate, or need a fully custom configuration for a specific CPU or GPU platform, our thermal engineering team can help you qualify the right path from design to production.

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December 02, 2025

Direct to Chip Cold Plates